Most thematic ETFs blend their exposure across layers of a supply chain that have very different risk profiles. We break each theme into its component layers and list the public companies operating in each, with live quotes and the Veridion Score. Identification, not recommendation.
Silicon → servers → memory → networking → neoclouds → energy. The full industrial supply chain behind the AI buildout, with the public companies actually doing the work in each layer.
Uranium miners, enrichers, fuel cycle services, small modular reactor developers, and the regulated utilities operating the existing US reactor fleet.
Airframes, payload sensors, autonomy chips, communications and ground-station software. Covers both defense and commercial-grade systems across small, medium, and large UAS classes.
Public pure-plays, incumbent hyperscalers with quantum programs, and the cryogenics, photonics, and control-electronics supply chain. Pre-commercial; sized for thematic exposure, not core allocation.
Prime contractors, missiles and munitions, autonomous and AI defense, C4ISR software, naval and submarine, and the ground vehicles still being delivered to the fleet.
Foundation models, compute, sensors and vision, actuators and motors, plus the OEMs and end-customers putting embodied AI on the warehouse floor.
Launch, satellites, connectivity constellations, earth observation, defense space systems, and the components and subsystems suppliers underneath all of it.
Identity and access, endpoint detection, network and firewall, cloud and SASE, vulnerability management, plus data security and observability. The full defense-in-depth stack.
Rare earth refining, mining and reserves, processing, recycling, downstream defense and EV demand, and the federal programs underneath domestic capacity.
AI datacenter load, independent power producers, nuclear-adjacent supply, grid and transmission, on-site power, cooling, and exposed utilities.
The chipmaking toolchain split into lithography, process tools, metrology, test, design software, and specialty subsystems.
Power silicon across wide-bandgap devices, analog control, discretes, inverter systems, and wafer materials.
Robotaxi and ADAS exposure across perception sensors, drive compute, mapping, simulation, and fleet operators.
Money movement mapped across card networks, processors, issuer rails, wallets, consumer credit, and B2B flows.
The public rails under digital assets: exchanges, brokers, custody-adjacent platforms, miners, tokenization, and treasury holders.
Software, sequencing, synthetic biology, clinical data, and manufacturing capacity inside the discovery workflow.
AR, VR, optics, sensors, compute, and application platforms separated into their operating layers.
The AI application layer across data platforms, observability, workflow SaaS, developer systems, and AI-native apps.